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Recruit

Á¦¸ñ »ï¼ºÀü±â ä¿ë°ø°í(MBA¹× °ø´ë)
±Û¾´ÀÌ »ï¼ºÀü±â ÀÛ¼ºÀÏ 2004-04-08 00:00:00
¼öÁ¤ÀÏ
2015-08-11 14:46:54
»ï¼ºÀü±â ä¿ë °ø°í

»ï¼ºÀü±â´Â âÀǷ°ú µµÀüÁ¤½ÅÀ» °®Ãá ÀÎÀ縦 ã°í ÀÖ½À´Ï´Ù.¹Ì·¡¸¦ ÇâÇÑ °ú°¨ÇÑ ÅõÀÚ¸¦ ÅëÇØ ¼¼°èÀûÀÎ ±â¾÷À¸·Î µµ¾àÇÏ°í ÀÖ´Â »ï¼ºÀü±â¿Í ÇÔ²² Àü¼¼°è¸¦ ¹«´ë·Î ¿©·¯ºÐÀÇ ´É·ÂÀ» ÆîÄ¥ ¼ö ÀÖ´Â ÀåÀÌ ¿©±â¿¡ ÀÖ½À´Ï´Ù.

1. ¸ðÁýºÐ¾ß (MBA ¹× °ø´ë)

¡á MBA(Marketing, Accounting, Management, °æ¿µ, etc.)

¡á ASIC ºÐ¾ß
°¡. Digital ½Åȣó¸® ºÐ¾ß
³ª. FEC IC/ RF IC ¼³°è¹ÝµµÃ¼ ȸ·Î ¼³°è
´Ù. ½Ã½ºÅÛ ºÐ¼®
¶ó. SOC Design
¸¶. CMOS¼¾¼­ ¼³°è
¹Ù. CMOS Analog ¼³°è
»ç. Digital È­»óó¸® ¼³°è

¡á CAEºÐ¾ß
  ±¤ÇÐ, µµ±Ý, ¿¡Äª, ¹ÝµµÃ¼ °øÁ¤ ÇÁ·Î¼¼½º µî¿¡ ´ëÇÑ Simulation ºÐ¾ß

¡á ±¤º¯Á¶±â¼ú ºÐ¾ß
°¡. Ferroelectric Materials & Device Processing : ¾ÐÀü/Àü¿Ö Àç·á°øÁ¤ (Sol-Gel/CVD/Sputtering) ¹× Device ÀÀ¿ë
³ª. Thin Film Processing °øÁ¤ºÐ¾ß]: (LP/PE)-CVD °øÁ¤ ¹× °ü·Ã Àåºñ ¿î¿µ
´Ù. Micro-Device °øÁ¤ºÐ¾ß  : Micro-Actuator based Micro-Machining ºÐ¾ß
¶ó. Packaging ¼³°è/Á¦ÀÛ/Æò°¡ ºÐ¾ß  : Micro-Optical Device Packaging ÀÌ·Ð/¼³°è/Á¦ÀÛ/Æò°¡ ¹× Çؼ®

¡á MLB ºÐ¾ß
°¡. °øÁ¤±â¼ú Fine Pattern Çü¼º±â¼ú (³ë±¤/¿¡Äª±â¼ú),  Stacked Via Çü¼º ±â¼ú (Via fill¿ë Ư¼öµµ±Ý), All Layer Build Á¦Á¶±â¼ú (BumpÇü¼º, ±Ý¼Ó Àú¿ÂÁ¢ÇÕ °í´ÙÃþ ±â¼ú, ¼ºÇü±â¼ú),  Small hole°¡°ø±â¼ú,  Bump etching ±â¼ú,  ±Ý¼Ó/±Ý¼Ó Á¢ÇÕ ±â¼ú,  Àý¿¬Ãþ ¼ºÇü ±â¼ú,  Bump °Ë»ç ±â¼ú,  Registration ±â¼ú,  High Aspect ratio µµ±Ý±â¼ú,  Plugging ½Å±â¼ú µµÀÔ

³ª. ±â¹Ý/¿ä¼Ò±â¼úLaser source control ±â¼ú,  Ç¥¸é/ģȯ°æ ÀÚÀç°ü·Ã±â¼ú, ÀÚÀç/Ç¥¸éó¸® ¾àÇ°°ü·Ã±â¼ú, ÀÚ¼ºÃ¼Çü¼º ±â¼ú.  ±¤ Á¢¼Ó ±â¼ú,  Low Df ¼ÒÀç°³¹ß´Ù.  ¼³°è/Æò°¡±â¼ú Opto electronics°ü·Ã¼³°è±â¼ú º¸À¯ÀÚ,  ¼³°è ±â¼ú,  °í¼Ó digital ¼³°è ±â¼ú,  Æò°¡ ±â¼ú,  ¿­, ¹°¸®, È­ÇÐÀû ¹°¼ººÐ¼®

¡á BGA ºÐ¾ß:¼³°èº¸Á¤±â¼ú, ±â°è°¡°ø±â¼ú, Cuµµ±Ý±â¼ú, ȸ·ÎÇü¼º±â¼ú, PSR±â¼ú, Ç¥¸é󸮱â¼ú, ÀûÃþ±â¼ú, ºÒ·®ºÐ¼®±â¼ú, Á¦Ç°°³¹ß±â¼ú, Bumping±â¼ú, ¹Ì¼¼È¸·Î(10/10§­)Çü¼º ±â¼ú, Registration Simulation±â¼ú, ¹Ì¼¼ bump print ±â¼ú, À̹° Á¦°Å ±â¼ú, Semi Additive ±â¼ú(Laser/ABF/CuPlating/Litho),FA(ºÒ·® ¿øÀÎ ºÐ¼®) ±â¼úMetrology±â¼ú, Developing/Etching ±â¼ú

¡á Á¤º¸ Device/ ¼ÒÀç ºÐ¾ß:MLCC ºÐ¾ß (MLCC, °íºÐÀÚ ÅºÅ» ¹× ÀüÇØ¿¡ »ç¿ëµÇ´Â °íºÐÀÚ), PVB, PVA, Acryl°èÀÇ Binder , Polypirol °íºÐÀÚÁ¤¹Ð±â±â ¿ä¼Ò±â¼ú , Step Motor Optical Pick Up , SMPS , Motor¿ë IC, LD(Laser Diode), LED (Light-Emitting Diode)

¡á ±âÃÊ¿¬±¸ ºÐ¾ß:RF(Bluetooth) , FEM (Front End Module), PDIC Photo Diode , RTOS System Software, Window Device Driver S/W2.


ÀϹݻçÇ×

¡á ±Ù¹«Ã³: »ï¼ºÀü±â ¿¬±¸¼Ò (¼ö¿ø,´ëÀü,ºÎ»ê)

¡á ÀÚ°Ý¿ä°Ç: Çлç, ¼®»ç, ¹Ú»çÇÐÀ§, MBA ¼ÒÁöÀÚ (°æ·ÂÀÚ ¿ì´ë)

¡á ±Ù¹«½Ã±â: ¡¯04-¡®05³â ±Ù¹« °¡´ÉÀÚ

¡á Á¦Ãâ¼­·ù: Resume(¿µ¹®), °æ·Â(±â¼ú)¼Ò°³¼­ (A4 1~2Àå), ÀÚ±â¼Ò°³¼­ (A4 1Àå), ¼ºÀûÇ¥ (On-line»óÀÇ Unofficial Transcript°¡´É)            
    ¡Ø fileÀ̸§À» ¿µ¹®À̸§, ÇÐÀ§(¼®/¹Ú»ç), Àü°ø, ¼­·ùÁ¾·ù·Î ¸í½Ã
    ¿¹) DonghyunLee_Master_IntlEdu_Resume.doc

¡á Á¦Ãâ¹æ¹ý: À̸ÞÀÏ Á¦Ãâ

¡á À̷¼­ Á¦Ãâ±â°£: ¡¯04. 04.21
  ¼­·ùÆò°¡          : ¡¯04. 04. 21~28
  ¹ÌÁÖÇöÁö¸éÁ¢    : ¡¯04. 5¿ù ¸»

¡á ó¿ì: °³º° ÇùÀÇ (»ç¿ø ~°£ºÎ ~ ÀÓ¿ø)

¡á ¿¬¶ôó ¹× ¹®ÀÇ»çÇ× À̵¿Çö °úÀå  °æ±âµµ ¼ö¿ø½Ã ¿µÅ뱸 ¸Åź3µ¿ 314¹øÁö ÀλçÆÀ ÀÎÀç°³¹ß±×·ì
E-Mail: dave.lee@samsung.com    Tel : 82-31-218-2881      Fax : 82-31-210-5087



Samsung Electro-Mechanics Recruiting the Leaders of Tomorrow!!


Samsung Electro-Mechanics are interested in recruiting Masters and PhD candidates in the areas of Electrical Engineering, Computer Science, Computer Engineering, Mechanical Engineering, Material Engineering, Industrial Engineering, Physics, Chemistry, and/or any related field.

Recruiting Field

MBA(Marketing, Accounting, Management, Business administration, etc.)

Materials
-  High Purity, Fine Powder Composition
-  Fine Line Printing, Circuit Module, Fine Processing, Multi-layer Integration, LTCC, High Speed Sintering
-  Low / High dielectic material / Ferrite Co-firing Joining Tech.

Process
-  Packaging (High yield, Electro Optic, Flip Chip)
-  High density Mounting Tech. (Bonding, Bumping, CSP)
-  Silicon Fine Processing Tech.
-  Optic Thin Film Coating

Components Design
-  RF Device Modeling & Design By Harmony of Material / Process / Circuit Design
-  MEMS (Bulk) Process Modeling & Design
-  RF / CMOS / Power Device Design
-  HOE
-  Electro / Micro-Optic

Optics Design
-  Precise mechanism Design / Production Tech.
-  Optical MEMS Actuator Design
-  Pick-Up Optical Design Tech.
-  High Frequency 3D Circuit

Circuit Design
-  Vibration Principle Analysis
-  RF IC

S / W  
- ASIC Design  
- Firmware & Middleware, Application S/W for Bluetooth & Network

Qualification  
- Must be lawfully permitted to work in South Korea

Requirements: Resume, Statement of Purpose (A4 1~2pages), Cover letter, Transcript                  (Unofficial Transcript from homepage is acceptable)        
        ¡Ø name of the files should have name_degree_major_documentname.doc                            
      Ex) DonghyunLee_Master_IntlEdu_Resume.doc

Recruiting Process
- Resume submission deadline : April 21
- Paper Review : April 21 ~ 28
- Final Interview : late May, 2004.

Contact Mr. Dave Lee.  We look forward to getting to know you and to help you discover your career potential with Samsung Electro-Mechanics!!!

Donghyun Lee (HR Manager/Recruiting Officer)
Tel: (82-31) 218-2881
Fax: (82-31) 210-5087
E-Mail: dave.lee@samsung.com






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